METHOD AND APPARATUS FOR CLEANING OF WAFER SURFACE USING DI WATER FILM AND DRY ICE

摘要

Disclosed is a wafer surface cleaning device for removing foreign materials from a surface of a wafer. The wafer surface cleaning device for removing foreign materials from a surface of a wafer by using a deionized water (DI water) layer and solid carbon dioxide dry ice includes a water layer forming unit including a wafer supporter supporting the wafer, a DI water supplying device supplying DI water, and a DI water spraying nozzle to spray the DI water supplied from the DI water supplying water to the surface of the wafer and forming the DI water layer on the surface of the wafer and a CO_2 dry ice injecting unit generating solid CO_2 dry ice by an adiabatic expansion of liquid CO_2 in or around the cleaning nozzle and injecting the solid CO_2 dry ice to a surface of the DI water layer formed by the water layer forming unit through the cleaning nozzle. The CO_2 dry ice injecting unit includes a liquid CO_2 supplying unit supplying the liquid CO_2 to the cleaning nozzle and a clean air supplying unit supplying clean air to the cleaning nozzle to accelerate CO_2 dry ice particles. The purpose of the present invention is to provide the wafer surface cleaning device and a wafer surface cleaning method capable of eco-friendly removing the fine foreign materials from the surface of the wafer by supplying the solid CO_2 dry ice on the surface of the DI water layer.