BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

A bump forming method includes: a bonding step of bonding the leading end of a wire extending out of the tip of a bonding tool to a first point (X1); a wire pay-out step of moving the bonding tool in a direction away from the first point; a thin portion forming step of pressing a portion of the wire at a second point (X2) on a reference plane using the bonding tool to form a thin portion (64) in the wire; a wire shaping step of shaping the wire bonded to the first point in a manner rising from the reference plane; and a bump forming step of cutting the wire at the thin portion to form a bump (60) having a shape rising from the reference plane at the first point. It is therefore possible to form a bump having a desired height more easily and efficiently.

主权项

1. A bump forming method of semiconductor devices using a bonding tool with a wire inserted therethrough, the method comprising:
a bonding step of lowering the bonding tool toward a first point on a reference plane and bonding the leading end of the wire extending out of the tip of the bonding tool to the first point; a wire pay-out step of moving the bonding tool in a direction away from the first point while paying out the wire from the tip of the bonding tool; a thin portion forming step of pressing a portion of the wire at a second point on the reference plane using the bonding tool to form a thin portion in the wire; a wire shaping step of moving the bonding tool along with the thin portion of the wire and shaping the wire bonded to the first point in a manner rising from the reference plane; and a bump forming step of cutting the wire at the thin portion to form a bump having a shape rising from the reference plane at the first point.