| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is achieved in reduction in height and in manufacturing cost of a semiconductor device, and its manufacturing method. <P>SOLUTION: The semiconductor device has a semiconductor chip (10), a bump electrode (12) formed on the upper surface of the semiconductor chip (10), a sealing part 14 sealing the entire side surface of the semiconductor chip (10) and sealing the bump electrode (12) to expose a part thereof, a re-wiring layer (16) which is formed on the upper surface of the sealing part (14) and electrically connected to the semiconductor chip (10) via the bump electrode (12) and an external connection electrode (18) which is formed on the upper surface of the re-wiring layer (16) and electrically connected to the bump electrode (12) via the re-wiring layer (16). According to this constitution, reduction in the height of the semiconductor device is made possible by polishing a rear of the semiconductor chip (10) and the sealing part (14). Furthermore, since the number of components is small, a manufacturing cost of the semiconductor device can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
