| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability of electrode connection and also protect the surface of integrated circuits. SOLUTION: A manufacturing method comprises a semiconductor integrated circuit board 100 having the main surface of a semiconductor integrated circuit, a pedestal 104a comprising an insulator of a polyimide resin or the like formed on the main surface of the semiconductor integrated circuit board 100, a conductor 105 having an extended portion extending to the upper surface of the pedestal 104a, as well as being formed on the main surface of the semiconductor integrated circuit board 100, and connected to a wiring 101 of the semiconductor integrated circuit, and a connecting substrate 300 connected to the extended portion of the conductor 105 on the upper surface of pedestal 104a, as well as facing the main surface of the semiconductor integrated circuit board 100. COPYRIGHT: (C)2005,JPO&NCIPI
|
