TREATING APPARATUS, METHOD OF TREATING AND PLASMA SOURCE

摘要

[PROBLEMS] A processing apparatus and a processing method that shorten a lead time and are more reliable than before in respect of the processing performance are provided. [MEANS FOR SOLVING PROBLEMS] The processing apparatus has a chamber, a retaining means provided in the chamber for retaining a workpiece, an active atom supplying means for supplying an active atom into the chamber, and a chemical supplying means for supplying a chemical into the chamber. For the surface of the workpiece, dry processing by the active atom supplied from the active atom supplying means and wet processing by the chemical supplied from the chemical supplying means are performed.