| 摘要 |
<p>An electronics chassis has many removable boards (50) on sleds (30) that are interconnected by a honeycomb interconnect structure. Interconnect boards (10,12) in Y planes and Z planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction parallel to surfaces of the interconnect boards. The removable boards have connectors (40,42,44) that mate with an edge of Z divider interconnect boards (14). Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure (16,18,19) is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers (16) are offset from the Z divider boards to allow removable boards to align with Z divider boards in the Z planes parallel to airflow.</p> |
