发明名称 COMPOSITION ANALYZING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a composition analyzing method, capable of analyzing the composition of a sample of a semiconductor element or the like, having an arbitrary shape with high spatial resolving power and high precision. SOLUTION: In the composition analyzing method, the coefficientαof correction is calculated from the ratio of the average value of actually measured attenuation distances, due to measurements of (n) times (n is an integer) in the microregion of a standard sample known in theoretical attenuation distance and the theoretical attenuation distance of a standard sample, determined on the basis of dynamic diffraction theory; a corrected attenuation distance is calculated by multiplying the actually measured attenuation distances due to the measurements in the microregion of a sample to be evaluated by the coefficientαof correction and, from a calibration curve, showing the relation between the composition determined on the basis of the dynamic diffraction theory and the attenuation distance; and a composition, corresponding to the corrected attenuation distance, is found out to calculate the composition of the microregion of the sample to be evaluated. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005208006(A) 申请公布日期 2005.08.04
申请号 JP20040017336 申请日期 2004.01.26
申请人 TOSHIBA CORP 发明人 TAKENO SHIRO;KOIKE MITSUO;TOMITA MITSUHIRO;KONNO TERUYUKI;SATAKE HIDEKI
分类号 G01N23/20;(IPC1-7):G01N23/20 主分类号 G01N23/20
代理机构 代理人
主权项
地址