INTEGRATED CIRCUIT WITH BACK SIDE INDUCTOR

摘要

A method for providing an inductively loaded integrated circuit includes providing a wafer with an integrated circuit formed thereon, the integrated circuit comprising at least one substrate via, including one or more substrate vias that are to be inductively loaded, and fabricating an inductive element on the backside of the wafer that electrically connects to the substrate vias that are to be inductively loaded. A corresponding apparatus includes a wafer with an integrated circuit formed on a top side of the wafer and an inductive element formed on a back side of the wafer, and at least one substrate via that extends through the wafer and electrically connects the inductive element to the integrated circuit. In certain embodiments, the inductive element comprises a plurality of conductive layers. In some embodiments, the inductive element comprises multiple turns on each conductive layer.

主权项

1. A method for providing an inductively loaded integrated circuit, the method comprising:
providing a wafer with an integrated circuit formed on a top side of the wafer, the integrated circuit comprising at least one substrate via etched from the top side of the wafer including one or more substrate vias that are to be inductively loaded; thinning the entire backside of the wafer to expose the at least one substrate via from the back side of the wafer; and fabricating an inductive element on the backside of the wafer that electrically connects to the substrate vias that are to be inductively loaded.