| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment apparatus, heat treatment method and program capable of reducing inter-surface temperature difference of an object to be treated.SOLUTION: A heat treatment apparatus 1 includes heaters 11-15 for heating a reaction tube 2, a temperature falling rate model storage section housing a plurality of semiconductor wafers W in the reaction tube 2, the temperature falling rate model storage stores a temperature falling rate model indicating the temperature and time in the reaction tube 2 until a predetermined temperature is reached, and a control section 50 for controlling the temperature and time of the interior of the reaction tube 2 to be the temperature and time indicated by the temperature falling rate model. The temperature falling rate model storage section stores a plurality of temperature falling rate models, the interior of the reaction tube 2 is sectioned into a plurality of zones, and the temperature falling rate model is set for each zone. The control section 50 sets a temperature falling rate model of different temperature falling rate on the basis of the zone, and heats the plurality of semiconductor wafers W housed in the reaction tube 2.SELECTED DRAWING: Figure 1 |
