COMPOUND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a compound semiconductor device for coping with various kinds of external dimensions or the like being required by a customer by setting a core module where a basic electronic circuit is mounted to one type. SOLUTION: This compound semiconductor device consists of a core module 20 that is formed in a first insulating case 26, and an outer second insulating case 33 that is provided with input/output connector parts 39 and 40 that are arranged so that the core module 20 is surrounded and a signal terminal part 41.