发明名称 |
ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide: an electronic-component-embedded substrate in which vibration is reduced even if distortion occurs in an electronic component within an embedding layer by the application of a voltage, and in which the generation of audible sounds caused by vibration is prevented or reduced; and a method for producing the electronic-component-embedded substrate.SOLUTION: An electronic-component-embedded substrate 1 includes: a substrate B; a first electronic component 10 mounted on a main surface of the substrate B; and an embedding layer R which is provided on the main surface of the substrate B, and in which the first electronic component 10 is embedded. The first electronic component 10 is a laminated ceramic capacitor including a ceramic laminate having: a laminated section; a first side section and a second side section that sandwich the laminated section therebetween; two end surfaces that oppose one another; and a side surface that connects the two end surfaces. The first side section is located between the laminated section and the main surface of the substrate B in the thickness direction that is the direction orthogonal to the main surface of the substrate B. The elastic modulus of the embedding layer R is smaller than the elastic modulus of the substrate B.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016105453(A) |
申请公布日期 |
2016.06.09 |
申请号 |
JP20150155196 |
申请日期 |
2015.08.05 |
申请人 |
MURATA MFG CO LTD |
发明人 |
HATTORI KAZUO;FUJIMOTO TSUTOMU;TAKAHASHI MASARU;FUJII CHIYOUICHIROU;ADACHI HIROFUMI |
分类号 |
H05K1/18;H01G2/06;H01G4/12;H01G4/30;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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