发明名称 基板処理方法
摘要 A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.
申请公布号 JP5979700(B2) 申请公布日期 2016.08.24
申请号 JP20110213272 申请日期 2011.09.28
申请人 株式会社SCREENホールディングス 发明人 宮城 雅宏;橋本 光治;遠藤 亨
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
代理机构 代理人
主权项
地址