发明名称 |
SEMICONDUCTOR DEVICE MEMBER, LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE MEMBER, AND LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER USING THE METHOD, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT EMITTING |
摘要 |
Provided is a semiconductor device member which has excellent heat resistance, light resistance, film forming characteristics and adhesiveness, and seals a semiconductor device without causing cracks, peeling and coloring and holds phosphor even when used for a long period of time. The semiconductor device member has a heating weight reduction of 50wt% or less, which is measured by a prescribed heating weight reduction measuring method, and a peeling rate of 30% or less, which is measured by a prescribed adhesiveness evaluation method. |
申请公布号 |
WO2008023746(A1) |
申请公布日期 |
2008.02.28 |
申请号 |
WO2007JP66310 |
申请日期 |
2007.08.22 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION;KATO, HANAKO;MORI, YUTAKA;KOBAYASHI, HIROSHI;TOMURA, TSUBASA |
发明人 |
KATO, HANAKO;MORI, YUTAKA;KOBAYASHI, HIROSHI;TOMURA, TSUBASA |
分类号 |
H01L23/29;C09K11/73;C09K11/80;G01N19/04;G01N25/20;H01L23/31;H01L33/32;H01L33/48;H01L33/50;H01L33/56;H01L33/62 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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