PRINTED CIRCUIT BOARD AND METHOD FOR PREPARATION THEREOF

摘要

Disclosed is a method for preparing a printed circuit board. The method comprises forming a conductive layer on an insulated layer substrate. The method further includes partitioning the conductive layer into a first area and a second area by applying a photoresist mask. Furthermore, the method includes applying a first etching process to the conductive layer to pattern a first set of features on the first area of the conductive layer. Thereafter, the method includes applying a second etching process to the conductive layer to pattern a second set of features on the second area of the conductive layer. The second set of features on the second area of the conductive layer has a finer pitch as compared to the first set of features on the first area of the conductive layer.