| 摘要 |
A method of manufacturing a flexible substrate for an electronic device having at least a barrier layer and a flattened layer above a flexible supporting member, in which the flattened layer is provided with at least a thermosetting resin layer. The method includes installing the barrier layer above the flexible supporting member, and installing the flattened layer by facing the thermosetting resin toward a face of the barrier layer and adhering the thermosetting resin and the barrier layer by heating. A method of manufacturing an electronic device and an electronic device manufactured thereby are also provided.
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