| 摘要 |
<p>A PCB and a manufacturing method of electronic device are provided to prevent yield drop of an electronic device by absorbing deflection of a PCB and the electronic device in reflow by a molten solder. A PCB(10c) includes a substrate electrode(12c). The substrate electrode includes a substrate electrode base(14c) and a protrusion(13c). A bottom electrode(22c) is arranged on a bottom of an electronic device, and is mounted on the substrate electrode base by soldering. The substrate electrode base is arranged from an outer edge of an electronic part to an inner side. The protrusion is protruded from the substrate electrode base. Width(L7) of the protrusion is smaller than width(L6) of the substrate electrode base. The protrusion is contacted in a wire of the PCB.</p> |
