APPARATUS FOR CUTTING ADHESIVE TAPE FOR SEMICONDUCTOR DIE

摘要

An apparatus for cutting and transferring an adhesive tape for a semiconductor die is provided to confirm the location of adhesive tape within the tape guide groove regardless of the width of the adhesive tape. An apparatus for cutting and transferring an adhesive tape for a semiconductor die comprise a roller part(100), a tape punching apparatus(300), and a tape guide unit(200). The roller part supplies an adhesive tape(T) for the semiconductor die stacking to the tape punching apparatus. The tape punching apparatus cuts the adhesive tape for the semiconductor die stacking supplied from the roller part into the constant size. The tape guide unit is positioned between the roller part and the tape punching apparatus. The tape guide unit receives the adhesive tape for the semiconductor die stacking from the roller part and delivers to the tape punching apparatus.