Method for fabricating and packaging an M x N phased-array antenna on a flexible substrate utilizing ink-jet printing

摘要

A method for fabricating an M×N, P-bit phased-array antenna on a flexible substrate is disclosed. The method comprising ink jet printing and hardening alignment marks, antenna elements, transmission lines, switches, an RF coupler, and multilayer interconnections onto the flexible substrate. The substrate of the M×N, P-bit phased-array antenna may comprise an integrated control circuit of printed electronic components such as, photovoltaic cells, batteries, resistors, capacitors, etc. Other embodiments are described and claimed.

主权项

1. A method for manufacturing an M×N, P-bit phased array antenna comprising:
ink jet printing and hardening a first layer on a substrate, wherein the first layer comprises:
one or more alignment marks;an RF coupler;M×N antenna elements; andtransmission lines, wherein the transmission lines comprise 2×M×N×P channel gap regions; ink-jet printing and hardening a first semiconductor layer within each of the 2×M×N×P channel gap regions and on top of the portion of the transmission lines adjacent to each of the 2×M×N×P channel gap regions; ink jet printing and hardening a first dielectric layer over the first semiconductor layer and on top of the portion of the transmission lines and of the portion of the substrate adjacent to the first semiconductor layer; ink jet printing and hardening a second conductive layer on top of the portion of the first dielectric layer positioned over the 2×M×N×P channel gap regions and on top of the portion of the substrate adjacent to the first dielectric layer, wherein the second conductive layer comprises 2×M×N×P contact pads adjacent to each of the 2×M×N×P channel gap regions with conducting lines from the first dielectric layer positioned over the 2×M×N×P channel gap regions to the 2×M×N×P contact pads; ink jet printing and hardening a second dielectric layer on top of substantially the second conductive layer and on top of the portion of the transmission lines and of the portion of the substrate adjacent to the second conductive layer, wherein the second dielectric layer comprises openings positioned over the 2×M×N×P contact pads; and ink jet printing and hardening a third conductive layer within each of the openings positioned over the 2×M×N×P contact pads and on top of a portion of the second dielectric layer.