发明名称 |
CIRCUIT ELEMENT PACKAGE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING APPARATUS THEREOF |
摘要 |
A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. |
申请公布号 |
WO2016144039(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
WO2016KR02111 |
申请日期 |
2016.03.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KUK, Keon;KO, Young-dae;BEAK, O-hyun;HAN, Eun-bong;KIM, Hyeon-hyang;JUNG, Yeon-kyoung;MUN, Il-ju |
分类号 |
H01L23/552;H01L23/60;H01L25/065 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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