POWER ELEMENT MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING THE POWER ELEMENT MOUNTING SUBSTRATE, POWER ELEMENT MOUNTING UNIT, METHOD FOR MANUFACTURING THE POWER ELEMENT MOUNTING UNIT, AND POWER MODULE

摘要

In a power element mounting substrate, a circuit layer is brazed on the surface of a ceramic board, and a power element is bonded on the surface of the circuit layer with solder. The circuit layer is formed of an Al alloy having an average purity of 98.0wt% or more but not more than 99.9wt% over the entire layer, the concentration of Fe contained on the side brazed to the ceramic board is less than 0.1wt%, and the concentration of Fe contained on the surface opposite to the brazed surface is 0.1wt% or more.