METHOD FOR FORMING BUMP AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO FORM BUMP BY SIMPLE PROCESS

摘要

PURPOSE: A method for forming a bump is provided to form a bump by a simple process by forming an opening in an insulation layer while using a through hole in a resist layer and by forming a metal layer coupled to a pad. CONSTITUTION: The first insulation layer has the first opening exposing the first part of a pad(12). The second insulation layer is formed on the first insulation layer and the first part of the pad. A resist layer(20) has a through hole(22) that two-dimensionally overlaps at least a part of the first opening. The second opening exposes at least a part of the first part through the through hole in the second insulation layer. A metal layer(30,32) coupled to the pad exposed by the second opening is formed by using the through hole.