| 摘要 |
This substrate has a supporting layer, a columnar first bump, and a second bump. The supporting layer has a main surface. The first bump is filled with a first conductive metal, and has a first upper surface and a side surface. The second bump contains a plurality of fine particles of a second conductive metal, and covers the first upper surface and a part of the side surface. The first bump is disposed on the main surface, or the first bump is connected to an electrode disposed on the main surface. The second bump has a protruding second upper surface. |
