| 发明名称 |
MECHANICALLY EMBEDDED HEATING ELEMENT |
| 摘要 |
Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed. |
| 申请公布号 |
US2016378140(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201514752695 |
申请日期 |
2015.06.26 |
| 申请人 |
Intel Corporation |
发明人 |
Bergmann Remi;Nokkonen Erkki;Paavola Juha;Luoma Hannu;Vallius Kari |
| 分类号 |
G06F1/16;H05B3/86;H05B3/00 |
主分类号 |
G06F1/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a heating element thermally coupled to an adhesive, wherein the adhesive is to bond a first portion of a computing device and a second portion of the computing device, wherein the heating element is capable to be heated in response to application of power, wherein the heated heating element is to cause release of a bond by the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. |
| 地址 |
Santa Clara CA US |
