METHOD OF INSPECTING CERAMIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a ceramic component for a semiconductor manufacturing apparatus small in organic material soiling by inspecting the ceramic component small in the soiling to a treated material in the ceramic component to be used under a reduced pressure environment.

SOLUTION: The ceramic component for the semiconductor manufacturing apparatus has ≥98% sintered compact density and ≤5 mass% carbon originating from adsorbed organic materials which is detected at a depth ≥5 nm from the surface in the measurement in the depth direction from the surface by an X-ray photoelectronic spectroscopy. The ceramic component for the semiconductor manufacturing apparatus has ≤Ra1 μm surface smoothness in the main surface roughness exposed in a treatment chamber of the semiconductor manufacturing apparatus.

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