| 摘要 |
A side view LED package is provided to minimize the loss of the light by irradiating the light to an incident surface of a light guide plate. A side view light emitting diode includes a semiconductor chip(20) emitting the light. A lead frame(10) includes a die pad(11) die-bonding the semiconductor chip and a lead pad(12) electrically connected to the semiconductor chip and separated from the die pad, and an electrode lead(13) extended in the die pad and the lead pad. A reflector mold is molded in the lead frame and is formed around the semiconductor chip. A support unit(40) is protruded from the lower part of the mold and lifts the center of the reflector from the mounting surface where the electrode lead is mounted.
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