DEVICE AND METHOD FOR MATERIALS PROCESSING USING LASER RADIATION

摘要

The invention relates to a device for materials processing using laser radiation, the device comprising a laser beam source (S), which emits pulsed laser radiation (3) that interacts with the material (5), a lens (6), which focuses the pulsed laser radiation (3) in the material (5) on a centre of interaction (7), the laser pulses interacting with the material (5) in the associated zones (8) surrounding the centres of interaction (7) so that material (5) is separated in the interaction zones (8), a scanning device (10), which adjusts the position of the centre of interaction in the material (5), and a control device (17), which controls the scanning device (10) and the laser beam source (S) such that a sectioned area (9) is formed in the material (5) by lining up the interaction zones (8), and the control device (17) controlling the laser beam source (S) and the scanning device (10) in such a way that adjacent centres of interaction (7) lie at a distance of a = 10 µm in relation to one another.