Stacked chips attached to heat sink having bonding pads

摘要

An integrated circuit comprises a heat sink devoid of electronic components and interposed between a back side of a bottom electronic chip and an upper exterior side of an encapsulation, the sink comprising a front side placed on the back side of the bottom electronic chip. The back side of the bottom electronic chip comprises pads and the front side of the sink comprises pads mechanically fastened to facing pads of the back side of the bottom electronic chip.

主权项

1. An integrated circuit comprising:
a substrate that extends mainly in a plane of the substrate, the substrate being equipped with electrical connections for electrically connecting the integrated circuit to an exterior electronic circuit and having an interior side; a top electronic chip and a bottom electronic chip, each of said electronic chips being electrically connected to the electrical connections by way of the substrate and each electronic chip comprising a front side turned toward the interior side of the substrate and a back side opposite the front side, the back side of the top electronic chip being located at a height H above the interior side of the substrate and being further from the interior side of the substrate than the back side of the bottom electronic chip; an encapsulation formed by a thick layer made of an electrically insulating material that coats the electronic chips, the thick layer forming an upper exterior side of the encapsulation parallel to the plane of the substrate; and a heat sink devoid of electronic components and interposed between the back side of the bottom electronic chip and the upper exterior side of the encapsulation, the heat sink comprising a front side placed on the back side of the bottom electronic chip and a back side opposite the front side, the back side being between a first and a second plane, which first and second planes are parallel to the plane of the substrate, these first and second planes being located 0.15×H below and 0.15×H above the back side of the top electronic chip, respectively,the thermal conductivity at 25° C. of the heat sink in a direction perpendicular to the plane of the substrate being at least two times higher than the thermal conductivity of the thick layer measured under the same conditions and in the same direction;wherein:
the back side of the bottom electronic chip comprises pads; and the front side of the heat sink comprises pads that are mechanically fastened to facing pads of the back side of the bottom electronic chip.