发明名称 METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR EPITAXIAL SUBSTRATES INCLUDING HEATING OF CARRIER GAS
摘要 An aspect of the present disclosure resides in a method for manufacturing a compound semiconductor epitaxial substrate including a substrate and a compound semiconductor epitaxial layer disposed on the substrate, the method including providing the substrate, heating a carrier gas, preparing a mixed gas by mixing the heated carrier gas with at least a portion of a source gas that is a source for the compound semiconductor epitaxial layer, the source gas having a lower temperature than the heated carrier gas, and forming the compound semiconductor epitaxial layer on the substrate by supplying the mixed gas onto the substrate.
申请公布号 US2016240369(A1) 申请公布日期 2016.08.18
申请号 US201615004004 申请日期 2016.01.22
申请人 Panasonic Corporation 发明人 KUDOU Chiaki
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method for manufacturing a compound semiconductor epitaxial substrate including a substrate and a compound semiconductor epitaxial layer disposed on the substrate, comprising: providing the substrate; heating a carrier gas; preparing a mixed gas by mixing the heated carrier gas with at least a portion of a source gas that is a source for the compound semiconductor epitaxial layer, the source gas having a lower temperature than the heated carrier gas; and forming the compound semiconductor epitaxial layer on the substrate by supplying the mixed gas onto the substrate.
地址 Osaka JP