发明名称 |
METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR EPITAXIAL SUBSTRATES INCLUDING HEATING OF CARRIER GAS |
摘要 |
An aspect of the present disclosure resides in a method for manufacturing a compound semiconductor epitaxial substrate including a substrate and a compound semiconductor epitaxial layer disposed on the substrate, the method including providing the substrate, heating a carrier gas, preparing a mixed gas by mixing the heated carrier gas with at least a portion of a source gas that is a source for the compound semiconductor epitaxial layer, the source gas having a lower temperature than the heated carrier gas, and forming the compound semiconductor epitaxial layer on the substrate by supplying the mixed gas onto the substrate. |
申请公布号 |
US2016240369(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201615004004 |
申请日期 |
2016.01.22 |
申请人 |
Panasonic Corporation |
发明人 |
KUDOU Chiaki |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a compound semiconductor epitaxial substrate including a substrate and a compound semiconductor epitaxial layer disposed on the substrate, comprising:
providing the substrate; heating a carrier gas; preparing a mixed gas by mixing the heated carrier gas with at least a portion of a source gas that is a source for the compound semiconductor epitaxial layer, the source gas having a lower temperature than the heated carrier gas; and forming the compound semiconductor epitaxial layer on the substrate by supplying the mixed gas onto the substrate. |
地址 |
Osaka JP |