FABRICATION OF SENSOR CHIP ASSEMBLIES WITH MICROOPTICS ELEMENTS

摘要

A method and apparatus for fabricating sensor chip assemblies. A photodetector wafer and an optics wafer are bonded to each other. Photodetectors are formed on the photodetector wafer. A circuit wafer is bonded to the photodetector wafer that is bonded to the optics wafer after forming the photodetectors on the photodetector wafer.