| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure has a substrate and a die stack of n die(s), wherein n≧1. The substrate has a first side, a second side and an opening extending from the first side to the second side. The die stack is disposed in the opening. The thickness of the substrate is substantially the same as the thickness of the die stack. |
| 申请公布号 |
US2016336295(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201615221011 |
申请日期 |
2016.07.27 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Kuo Chien-Li |
| 分类号 |
H01L23/00;H01L23/538;H01L21/56;H01L21/78 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a semiconductor package structure, comprising:
attaching a substrate to a carrier, the substrate having a first side, a second side and an opening extending from the first side to the second side, wherein the substrate comprises a redistribution layer and a via; and attaching a die stack of n die(s) to the carrier through the opening, wherein n≧1; wherein the thickness of the substrate is substantially the same as the thickness of the die stack, and the redistribution layer and the via do not overlap with the die stack in a top view. |
| 地址 |
Hsinchu TW |
