CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

摘要

In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.

主权项

1. A structure comprising circuitry comprising a semiconductor integrated circuit, the circuitry comprising a conductive connecting feature which has a first end and a second end, the connecting feature extending along a first line from the first end to the second end, wherein at each point of the first line, the connecting feature has a transversal cross-sectional area which is an area of the connecting feature's cross section perpendicular to the first line at said point;
wherein the connecting feature comprises a first segment, a second segment physically contacting the first segment, and a third segment physically contacting the second segment, wherein surfaces of the first, second and third segments have the same melting temperature; wherein the first segment has a first end and a second end which is located at a junction with the second segment; wherein the third segment has a first end which is located at a junction with the second segment, and the third segment has a second end; wherein the transversal cross-sectional area:
decreases from the first end of the first segment to the junction of the first and second segments;increases from the junction of the first and second segments to a position in the second segment;decreases from said position in the second segment to a junction of the second and third segments; andincreases from the junction of the second and third segments to the second end of the third segment; wherein at least one of the following is true: (1) the length of the second segment is at most 50% of the length of each of the first and third segments; (2) the volume of the second segment is at most 50% of the volume of each of the first and third segments.