发明名称 |
SYSTEM FOR TREATMENT OF DEPOSITION REACTOR |
摘要 |
A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation. |
申请公布号 |
US2016376700(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201615262990 |
申请日期 |
2016.09.12 |
申请人 |
ASM IP Holding B.V. |
发明人 |
Haukka Suvi;Shero Eric James;Alokozai Fred;Li Dong;Winkler Jereld Lee;Chen Xichong |
分类号 |
C23C16/44 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
1. A system for treating a reaction chamber, the system comprising:
a reactor comprising a reaction chamber; a metal halide source fluidly coupled to the reactor; a metal CVD source selected from the group consisting of one or more of organometallic compounds and aluminum CVD compounds fluidly coupled to the reactor; a treatment reactant source coupled to the reactor; a vacuum pump coupled to the reactor; and a controller configured to perform a reaction chamber treatment using a treatment reactant from the treatment reactant source before or during introduction of the metal CVD precursor to the reaction chamber. |
地址 |
Almere NL |