发明名称 SYSTEM FOR TREATMENT OF DEPOSITION REACTOR
摘要 A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.
申请公布号 US2016376700(A1) 申请公布日期 2016.12.29
申请号 US201615262990 申请日期 2016.09.12
申请人 ASM IP Holding B.V. 发明人 Haukka Suvi;Shero Eric James;Alokozai Fred;Li Dong;Winkler Jereld Lee;Chen Xichong
分类号 C23C16/44 主分类号 C23C16/44
代理机构 代理人
主权项 1. A system for treating a reaction chamber, the system comprising: a reactor comprising a reaction chamber; a metal halide source fluidly coupled to the reactor; a metal CVD source selected from the group consisting of one or more of organometallic compounds and aluminum CVD compounds fluidly coupled to the reactor; a treatment reactant source coupled to the reactor; a vacuum pump coupled to the reactor; and a controller configured to perform a reaction chamber treatment using a treatment reactant from the treatment reactant source before or during introduction of the metal CVD precursor to the reaction chamber.
地址 Almere NL