| 发明名称 |
SUBSTRATE HOLDING DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| 摘要 |
According to one embodiment, there is provided a substrate holding device, in which, when a substrate is mounted on a chuck main body, gas is exhausted from a space between the substrate and a bottom face part, to hold the substrate by suction. The chuck main body includes a plurality of pins fixed to the bottom face part in a mounting area for a substrate. Two or more movable bottom portions are disposed to cover the mounting area for the substrate and to be movable in an extending direction of the pins, in a state where the pins are inserted in the movable bottom portions. |
| 申请公布号 |
US2016225650(A1) |
申请公布日期 |
2016.08.04 |
| 申请号 |
US201514695449 |
申请日期 |
2015.04.24 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
KOMINE Nobuhiro;KURIYAMA Taketo |
| 分类号 |
H01L21/68;H01L21/683;H01L21/02;H01L21/66 |
主分类号 |
H01L21/68 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate holding device comprising:
a chuck main body including a plurality of pins fixed to a bottom face part in a mounting area for a substrate; and two or more movable bottom portions disposed to cover the mounting area for the substrate and to be movable in an extending direction of the pins, in a state where the pins are inserted in the movable bottom portions, wherein, when the substrate is mounted on the chuck main body, gas is exhausted from a space between the substrate and the bottom face part, to hold the substrate by suction. |
| 地址 |
Minato-ku JP |
