发明名称 RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin multilayer substrate which improves coplanarity of a principal surface of a laminate.SOLUTION: A resin multilayer substrate 101 includes a laminate 1 in which a plurality of resin layers 2 are laminated, and at least a part of the resin layer 2 out of the plurality of resin layers 2 includes a first-class conductor pattern 5 formed of a conductor foil formed thereon, and a first-class conductor via 6 passing through the inside of the resin layer 2 so as to be connected to the first-class conductor pattern 5. A first-class resin layer 2f forming the outermost surface which is at least one of the main surface of the laminate 1 includes a second-class conductor pattern 7 formed by printing so as to expose to the outermost surface, and a second-class conductor via 8 which continues to the second-class conductor pattern 7 and passes through the first resin layer 2f. The second-class conductor pattern 7 and the second-class conductor via 8 are formed integrally with each other by the printing.SELECTED DRAWING: Figure 1
申请公布号 JP2016213416(A) 申请公布日期 2016.12.15
申请号 JP20150098399 申请日期 2015.05.13
申请人 MURATA MFG CO LTD 发明人 ADACHI TOSHIRO
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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