RESIN COMPOSITION, AND PREPREG, LAMINATE, AND PRINTED WIRING BOARD USING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a prepreg using a resin composition that is superior particularly in heat resistance and low thermal expansion, and to provide a laminate and a printed wiring board using the prepreg.SOLUTION: A prepreg uses a resin composition which contains (a) a maleimide compound having at least two N-substituted maleimide groups in one molecular structure, and (b) a silicone compound having at least one reactive organic group in one molecular structure. In the prepreg, the component (b) is a silicone compound containing a structure represented by general formula (II). A laminate and a printed wiring board are provided using the prepreg.SELECTED DRAWING: None