发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes: a semiconductor layer; a high dielectric constant gate insulation film disposed above the semiconductor layer, the high dielectric constant gate insulation film containing a plurality of elements; a gate electrode disposed on the high dielectric constant gate insulation film; and an impurity region disposed in the semiconductor layer and serving as one of a source region and a drain region, wherein the gate electrode includes a first gate electrode layer made of a material hardly bonded to at least one of the elements included in the high dielectric constant gate insulation film.
申请公布号 US2006220158(A1) 申请公布日期 2006.10.05
申请号 US20060393073 申请日期 2006.03.29
申请人 SEIKO EPSON CORPORATION 发明人 TAKIZAWA TERUO
分类号 H01L29/94 主分类号 H01L29/94
代理机构 代理人
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