| 发明名称 |
METHOD OF FABRICATING HIGH DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS USING INSULATED WIRE BUNDLES |
| 摘要 |
A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them. |
| 申请公布号 |
US2016254080(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201615147774 |
申请日期 |
2016.05.05 |
| 申请人 |
Shah Kedar G.;Bennett William J.;Pannu Satinderpall S. |
发明人 |
Shah Kedar G.;Bennett William J.;Pannu Satinderpall S. |
| 分类号 |
H01B17/30;H01B13/00;H01B13/06;A61N1/375;H02G3/22 |
主分类号 |
H01B17/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating hermetic electrical feedthroughs, comprising:
coating each of a plurality of electrically conductive wires with an electrically insulating material; inserting the coated wires through a ring-like structure to bundle the coated wires together in a substantially parallel arrangement; fixedly joining the electrically insulating material of adjacent wires together and to the ring-like structure to form a gapless hermetic monolithic block; and cutting the monolithic block transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending therebetween. |
| 地址 |
Oakland CA US |
