| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method which can shorten processing time, and improve throughput without increasing the number of processor, and to provide its apparatus. SOLUTION: The apparatus comprises: a spin chuck 10 holding a wafer W rotatably in a horizontal state; a resist nozzle 20 dropping resist on the front surface of the wafer held by the spin chuck; a backside cleaning nozzle 30 supplying a cleaning liquid to the backside of the wafer; and a CPU 50 which controls a rotation control of the spin chuck, dropping/stopping of the resist of the resist nozzle, and supplying/stopping of the cleaning liquid of the backside cleaning nozzle. Based on a control signal from the CPU, after the resist is spread on a wafer front surface by rotating the wafer on which the resist is dropped, and before a resist film is dried, the apparatus is formed so that the cleaning liquid can be supplied to the backside of the wafer from the backside cleaning nozzle. COPYRIGHT: (C)2007,JPO&INPIT
|
