发明名称 基板液処理装置及び基板液処理方法
摘要 Disclosed is a substrate liquid processing apparatus including: a first processing liquid supply mechanism provided with a first tank in which a processing liquid is stored and a first nozzle through which the processing liquid stored in the first tank is ejected, and configured to supply the processing liquid to a first surface of a substrate by the first nozzle; a second processing liquid supply mechanism provided with a second tank in which a processing liquid having the same composition as the processed liquid stored in the first tank is stored and a second nozzle through which the processed liquid stored in the second tank is ejected, and configured to supply the processed liquid to a second surface of the substrate by the second nozzle; a processing unit configured to perform processing on the substrate using the processed liquids supplied by the first nozzle and the second nozzle; and a recovery line configured to recover the processed liquids which are supplied to the substrate from the first nozzle and the second nozzle and mixed with each other from the processing unit and return the recovered processed liquids to the second tank.
申请公布号 JP6022431(B2) 申请公布日期 2016.11.09
申请号 JP20130216725 申请日期 2013.10.17
申请人 東京エレクトロン株式会社 发明人 高 木 康 弘;田 中 幸 二;冨 永 瞬
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
代理机构 代理人
主权项
地址