| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the external electrode from cracks, a manufacturing method thereof, a circuit board and an electronic apparatus. SOLUTION: The semiconductor device includes an insulating film 14 provided with a through-hole 14a, a semiconductor chip 12 having an electrode 13, a wiring pattern 18 pasted through an adhesive 17 to a region, including the through-hole 14a on one side at the insulating film 14 and electrically connected to the electrode 13 of the semiconductor chip 12, and an external electrode 16 provided on the wiring pattern 18 via the through-hole 14a and projecting from the opposite side of the wiring pattern 18. A part of the adhesive 17 is drawn in and are interposed between the through-hole 14a and the external electrode 16. COPYRIGHT: (C)2007,JPO&INPIT |
