发明名称 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent developability, and capable of reducing sufficiently out-gassing after cured, and a photosensitive element using the same. <P>SOLUTION: This photosensitive resin composition contains (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a compound having a heterocyclic ring. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009003369(A) 申请公布日期 2009.01.08
申请号 JP20070166602 申请日期 2007.06.25
申请人 HITACHI CHEM CO LTD 发明人 SESATO YASUHIRO
分类号 G03F7/032;C08F290/00;C08G63/66;G03F7/004;H01L23/10;H05K1/03 主分类号 G03F7/032
代理机构 代理人
主权项
地址