发明名称 MULTI-LAYER BARRIER FOR METALLIZATION
摘要 A solar cell can include a substrate, a semiconductor region disposed in or above the substrate, and a conductive contact disposed on the semiconductor region that includes a first conductive region disposed on the semiconductor region, a first barrier region disposed on the first conductive region, a second barrier region disposed on the first barrier region, and a second conductive region disposed over the second barrier region.
申请公布号 WO2016210188(A1) 申请公布日期 2016.12.29
申请号 WO2016US39112 申请日期 2016.06.23
申请人 SUNPOWER CORPORATION;TOTAL MARKETING SERVICES 发明人 BARKHOUSE, David Aaron Randolph;JOHNSON, Todd Richard;LOSCUTOFF, Paul;WOEHL, Robert
分类号 H01L31/04;H01L21/306;H01L31/0232;H01L31/0288;H01L31/0392 主分类号 H01L31/04
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