发明名称 |
MULTI-LAYER BARRIER FOR METALLIZATION |
摘要 |
A solar cell can include a substrate, a semiconductor region disposed in or above the substrate, and a conductive contact disposed on the semiconductor region that includes a first conductive region disposed on the semiconductor region, a first barrier region disposed on the first conductive region, a second barrier region disposed on the first barrier region, and a second conductive region disposed over the second barrier region. |
申请公布号 |
WO2016210188(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
WO2016US39112 |
申请日期 |
2016.06.23 |
申请人 |
SUNPOWER CORPORATION;TOTAL MARKETING SERVICES |
发明人 |
BARKHOUSE, David Aaron Randolph;JOHNSON, Todd Richard;LOSCUTOFF, Paul;WOEHL, Robert |
分类号 |
H01L31/04;H01L21/306;H01L31/0232;H01L31/0288;H01L31/0392 |
主分类号 |
H01L31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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