发明名称 METHOD OF MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To realize a method of mounting electronic components on a printed circuit board and a printed circuit board, in which satisfactory soldering properties can be maintained even after long time storage subsequent to first soldering in performing a plurality times of soldering. SOLUTION: A printed circuit board 10 in which a protective film 13 is formed on a land part 12 through a pre-flux treatment is kept in an oxidative atmosphere thereby forming an oxidized film 14 under the protective film 13 for covering the land part 12. As a result, even when an active agent component scatters and adhered to the land part 12 again in a step of primary soldering using a cream solder 15 containing a post flux soldering, the active agent component does not contact directly with the surface of the land part 12. Accordingly, even when the printed circuit board is stored for a long period of time after subjected to primary soldering, the oxidation of the land part 12 due to the reaction of the active agent component with a moisture and the like in the atmosphere can be prevented from progressing. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009088454(A) 申请公布日期 2009.04.23
申请号 JP20070259940 申请日期 2007.10.03
申请人 DENSO CORP 发明人 KAMIMURA ATSUSHI
分类号 H05K3/34 主分类号 H05K3/34
代理机构 代理人
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