| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing a semiconductor, capable of preventing a bonding material for bonding a frame body and a coaxial connector holder from flowing into a mounting portion of a circuit board, and a semiconductor device including the same.SOLUTION: A package for storing a semiconductor comprises: a base body 1 having a placing portion 1a having a semiconductor element 8 placed thereon; a frame body 2 provided so as to surround the placing portion 1a and having an attaching portion 2a; a coaxial connector holder 3 bonded to the attaching portion 2a via a bonding material, and having a first side surface 3c provided with a mounting portion 3b having a circuit board 5 including a line conductor layer 5a electrically connected to the semiconductor element 8 mounted thereon, and positioned inside the frame body 2, and a second side surface 3d facing the bonding material; and a coaxial connector 4 attached to a connector attaching portion 3a of the coaxial connector holder 3. The coaxial connector holder 3 includes a third side surface 3e formed by chamfering corner portions thereof between the first side surface 3c and the second side surface 3d. |
