发明名称 ELECTROSTATIC CHUCK FOR VACUUM BONDING EQUIPMENT AND VACUUM BONDING EQUIPMENT USING SAME
摘要 PROBLEM TO BE SOLVED: To prevent breakage of an electrostatic attraction functioning part due to biting of a foreign material. SOLUTION: At least one layer of a dielectric protecting layer 1c having a prescribed thickness is provided on a surface of a dielectric layer 1b; a portion between a board contact plane 1' of the dielectric protecting layer 1c arranged on the outermost side and an electrode layer 1a is permitted to have a laminate structure composed of a plurality of layers; and thereby, a distance between the board contact plane 1' and the electrode layer 1a is increased by the thickness of the dielectric protecting layer 1c. This reduces the probability of causing damages to the electrode layer 1a due to biting of a large foreign material, as well as, even when the board contact plane 1' of the dielectric protecting layer 1c is scratched by biting of a small foreign material, cracks do not reach the dielectric layer 1a by being prevented from advancing by the dielectric protecting layer 1c. When the layer constitution is divided while maitaining the entire thickness from the board contact plane 1' to the electrode layer 1a substantially the same, cracks do not reach the dielectric layer 1a by being prevented from advancing by the dielectric protecting layer 1c in the same manner. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008026338(A) 申请公布日期 2008.02.07
申请号 JP20040316173 申请日期 2004.10.29
申请人 SHIN-ETSU ENGINEERING CO LTD;TOMOEGAWA PAPER CO LTD 发明人 OTANI YOSHIKAZU;SHIMA TAKESHI;KAWASE RITSU
分类号 G09F9/00;G02F1/13;H01L21/683 主分类号 G09F9/00
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