| 摘要 |
PROBLEM TO BE SOLVED: To prevent the separation of wire due to heating after wire bonding as much as possible in a method for producing an electronic device which is formed by wire-bonding and soldering to a power chip provided with a wire pad composed of an Au-plated layer on an undercoat whose surface is a Ni-plated layer and a solder land for soldering.SOLUTION: The method for producing an electronic device comprises a soldering step of soldering a terminal 50, a wire-bonding step of joining a wire 40 to a wire pad 21 thereafter, a heating step of heating a power chip 20 thereafter. Then, a Ni diffusion step in which Ni is diffused from a Ni-plated layer 211 to the surface of an Au-plated layer 212 in the wire pad 21 is carried out by heating the prepared power chip 20 before the soldering step. |
