| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for electrical component in which the contact pressure of an electric contact can be reduced significantly for the electrode of an electrical component.SOLUTION: In an IC socket 12 where an IC package 11 is housed in an upper plate 14, a lower plate 16 is disposed oppositely on a wiring board 10, an intermediate plate 15 is located between the upper and lower plates 14, 16, and the IC package 11 and a wiring board 10 are connected electrically by a plurality of wire probes 13, the wire probes 13 includes a substantially hooked spring 13a inserted into the insertion hole 15a of the intermediate plate 15, a first contact part 13b extending from the first spring region 13e of the spring 13a, and inserted into the insertion hole 14a of the upper plate 14 so as to come into contact with the solder ball 11a of the IC package 11, and a second contact part 13c extending from the second spring region of 13f of the spring 13a, and inserted into the insertion hole 16a of the lower plate 16 so as to come into contact with the electrode 10a of the wiring board 10.SELECTED DRAWING: Figure 2 |
