发明名称 |
METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION CHIP, PIEZOELECTRIC VIBRATION CHIP AND PIEZOELECTRIC DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric vibration chip by which the cross section of a vibration arm of the piezoelectric vibration chip (20) is formed in an exact rectangle shape. <P>SOLUTION: The method for manufacturing the piezoelectric vibration chip has: a step (S112) of preparing a flat piezoelectric material having etching anisotropy; a step (S112) of forming corrosion-resisting films on both sides of the piezoelectric material; a first application step (S114) of applying photoresist onto both sides of the corrosion-resisting films; a first exposure step (S116) of exposing a pattern of the piezoelectric vibration chip only on one side of the piezoelectric material; a step (S118) of developing the photoresist after the first exposure step to remove the corrosion-resisting film appearing only on one side; and a first etching step (S126) of etching the piezoelectric material appearing by removing the corrosion-resisting film. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008167171(A) |
申请公布日期 |
2008.07.17 |
申请号 |
JP20060354588 |
申请日期 |
2006.12.28 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
IWAI HISASHI |
分类号 |
H03H3/02;H01L41/09;H01L41/18;H01L41/22;H01L41/332;H01L41/335;H03H9/19;H03H9/215 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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