发明名称 METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION CHIP, PIEZOELECTRIC VIBRATION CHIP AND PIEZOELECTRIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric vibration chip by which the cross section of a vibration arm of the piezoelectric vibration chip (20) is formed in an exact rectangle shape. <P>SOLUTION: The method for manufacturing the piezoelectric vibration chip has: a step (S112) of preparing a flat piezoelectric material having etching anisotropy; a step (S112) of forming corrosion-resisting films on both sides of the piezoelectric material; a first application step (S114) of applying photoresist onto both sides of the corrosion-resisting films; a first exposure step (S116) of exposing a pattern of the piezoelectric vibration chip only on one side of the piezoelectric material; a step (S118) of developing the photoresist after the first exposure step to remove the corrosion-resisting film appearing only on one side; and a first etching step (S126) of etching the piezoelectric material appearing by removing the corrosion-resisting film. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008167171(A) 申请公布日期 2008.07.17
申请号 JP20060354588 申请日期 2006.12.28
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 IWAI HISASHI
分类号 H03H3/02;H01L41/09;H01L41/18;H01L41/22;H01L41/332;H01L41/335;H03H9/19;H03H9/215 主分类号 H03H3/02
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