| 摘要 |
A silicone adhesive used for bonding semiconductor device, containing (A) addition reaction-curable silicone resin composition having viscosity at 25° C. of 100 Pa·s or less, (B) thermal conductive filler having average particle size of 0.1 μm or more and less than 1 μm, and (C) solvent having boiling point of 250° C. or higher and lower than 350° C., wherein component (B) is contained in an amount of 100 to 500 parts by mass based on 100 parts by mass of component (A), component (C) is contained in an amount of 5 to 20 parts by mass based on 100 parts by mass of component (A), and silicone adhesive uncured has viscosity at 25° C. of 5 to 100 Pa·s. Thus, silicone adhesive has good workability in transferring method to substrate, and is capable of providing cured product that can effectively dissipate heat generated from chip and exhibits high adhesiveness and durability. |
