Au-BASED SOLDER BALL, CERAMIC ELECTRONIC COMPONENT SEALED OR BONDED WITH THE SANE AND EVALUATION METHOD OF JOINT RELIABILITY OF Au-BASED SOLDER BALL

摘要

PROBLEM TO BE SOLVED: To provide an Au-based solder alloy having high joint reliability even when the content of Au is reduced compared with that of the conventional one.SOLUTION: Au-based solder ball used for sealing or bonding a ceramic electronic component is formed with: an Au-Sn-Ag alloy consisting of 21.1-43.0 mass% of Sn, 0.1-15 mass% of Ag and the balance of inevitable impurities and Au; an Au-Ge-Sn alloy consisting of 9.5-15 mass% of Ge, 2-10 mass% of Sn and the balance of inevitable impurities and Au; or an Au-Ag-Ge alloy consisting of 5-18 mass% of Ag, 7-20 mass% of Ge and the balance of inevitable impurities and Au. Maximum stress until causing a crack after the solder ball is pressed and crushed from one direction is 2.0×10N/mmor more and a square root of strain until causing the crack is 0.40 or more.SELECTED DRAWING: None